Realme introduced the Snapdragon 888 powered Realme GT in China earlier this month. While the company is yet to officially reveal the GT Neo’s specifications, it today has confirmed that the GT Neo will be unveiled on March 31 at 2:30 PM (6:30 AM UTC) in Beijing, China.
The device will be powered by the MediaTek Dimensity 1200 SoC which was launched back in January alongside the MediaTek Dimensity 1100. The SoC features a Cortex-A78 clocked at 3.0 GHz, three Cortex-A78 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz along with a Mali-G77MC9. The processor is based on a 6nm process.
A couple of days back, an unknown Realme smartphone bearing model number RMX3116 and believed to be the GT Neo was spotted on TENAA with a 6.55″ curved screen, Android 11, and a 4,400mAh dual-cell battery. The phone’s back panel houses a huge “Dare To Leap” branding with a rectangular camera module which appears to house three cameras and LED flash.
Previously, Realme India and Europe’s CEO Madhav Sheth teased an upcoming device that will sport the MediaTek flagship MediaTek Dimensity 1200 chipset. The company confirmed that it would be one of the first few brands to release a smartphone being powered by the chipset.
WHYLAB on Weibo tipped that a smartphone reportedly named the Realme X9 Pro will pack in the MediaTek Dimensity 1200 processor, a left-aligned single punch-hole FHD+ panel, a 90Hz refresh rate, a 108MP primary camera, a 4,500mAh battery, and 65W fast charging. Some reports also show that the device may feature a 2K display, 160Hz refresh rate, run on Android 11 OS, and come on 125W fast-charging support.
While the company hasn’t announced a launch timeline, but we may soon expect the company to bring them to India and the other markets.
